Samsung Electronics is set to revolutionise AI chip production with a new one-stop shop approach.
By integrating its memory chip, foundry, and chip packaging services, Samsung aims to cut production time by 20%. This streamlined process allows clients to communicate through a single channel, expediting the typically weeks-long production cycle.
"We are truly living in the age of AI," said Siyoung Choi, President and General Manager of Samsung's Foundry Business, at a recent event in San Jose, California. Samsung forecasts that the global chip industry revenue will surge to $778 billion by 2028, driven by the AI boom.
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Samsung’s innovative gate all-around (GAA) chip architecture is a game-changer, enhancing chip performance while reducing power consumption. Although competitors like TSMC are also developing GAA technology, Samsung has a head start and plans to mass-produce its second-generation 3-nanometre chips later this year.
Additionally, Samsung unveiled its latest 2-nanometre chipmaking process, designed for high-performance computing. This new process, which improves power delivery by placing power rails on the backside of the wafer, is slated for mass production in 2027.
With skyrocketing demand for AI chips, Samsung’s turnkey approach could be a significant strength, despite past concerns from clients about potential conflicts of interest. The company believes that the need for highly integrated chip parts to handle vast amounts of data efficiently will make its comprehensive service offering particularly valuable.
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